LA-60 Breadboard for Brick, Arduino

01. 6 interconnected round tie points per row in horizontal array provide an ideal placement and more tie point for DIP size chip.

02. Power BUS
      Each of continual interconnected tie point with black line marking COM, and each of continual interconnected tie points with red line marking V1、V2、V3、V4、V5、 V6

03. Interconnected “Round” tie point make your wiring easier, and it accepts solid wires from AWG #22~30 (0.3~0.8mm)

04. Easy combination & expansion

05. Easy insertion & wiring

06. Flexible for simple circuit、Brick、ARDUINO circuits.

07. Dimension : 68 x 60 x 8 (L x W x H, m/m)

08. TIE - POINTS : 360

09. 6 interconnected clip : 60

10. Standard packaging : 1 Breadboard, 8 Brick compatible posts